@article{Andonova_2014, title={Thermal Analysis of MCM Packaging}, volume={20}, url={https://eejournal.ktu.lt/index.php/elt/article/view/7110}, DOI={10.5755/j01.eee.20.5.7110}, abstractNote={This paper describes the use of infra-red thermography for the thermal study in the development stage of custom enclosures for multi-chip modules. Some limitations of conventional thermographic measurements are discussed and an approach for enhancing its application to quality control and diagnostics of faulty multi-chip module packages is proposed. The results from thermal measurements of radio-frequency range multi-chip module prototype in an open and a closed Quad Flat No Lead package are presented. <p>DOI: <a href="http://dx.doi.org/10.5755/j01.eee.20.5.7110">http://dx.doi.org/10.5755/j01.eee.20.5.7110</a></p>}, number={5}, journal={Elektronika ir Elektrotechnika}, author={Andonova, A.}, year={2014}, month={May}, pages={112-115} }