TY  - JOUR
AU  - Andonova, A.
PY  - 2014/05/13
Y2  - 2025/01/02
TI  - Thermal Analysis of MCM Packaging
JF  - Elektronika ir Elektrotechnika
JA  - ELEKTRON ELEKTROTECH
VL  - 20
IS  - 5
SE  - 
DO  - 10.5755/j01.eee.20.5.7110
UR  - https://eejournal.ktu.lt/index.php/elt/article/view/7110
SP  - 112-115
AB  - This paper describes the use of infra-red thermography for the thermal study in the development stage of custom enclosures for multi-chip modules. Some limitations of conventional thermographic measurements are discussed and an approach for enhancing its application to quality control and diagnostics of faulty multi-chip module packages is proposed. The results from thermal measurements of radio-frequency range multi-chip module prototype in an open and a closed Quad Flat No Lead package are presented. <p>DOI: <a href="http://dx.doi.org/10.5755/j01.eee.20.5.7110">http://dx.doi.org/10.5755/j01.eee.20.5.7110</a></p>
ER  -